PRIMARY PURPOSE:

主要關注重點開發新產品所需未有之技術, 整合各單位資源開發重點新產品所需技術缺口.

Mainly focus on the technology gap that is not required for the development of new products, and integrate the resources of each unit to develop the technology gaps required for key new products.

1.

負責確認NPI 關鍵料號相關製程之狀況, 將樣品生產數據進行統計數據分析, 並搭配收集材料特性資料 來依據統計分析結果將技術缺口進行開發計畫, 達到開發目的後導入生產.

Responsible for confirming the status of NPI key material number related processes, conduct statistical data analysis of sample production data, and collect material characteristic data to develop development plans for technical gaps based on statistical analysis results, and import them into production after achieving development goals.

2.

負責技術能力缺口開發專案執行, 達成公司與部門營運目標

Responsible for the Molex FPC technology gap development projects to achieve company and departmental operational goals.

3.

負責新設備和新材料之應用評估與開發

Responsible for the new equipment of capability improve and new materials of new product requirement evaluation and process capability improve

4.

完成開發之新技術/設備/材料應用方式轉交PE, PE驗證後標準化至生產單位.

Responsible for New technology/equipment/material technology will be transferred to PE, and standardized to production unit after PE verification.

SCOPE:

· NPI重點汽車與醫療產品從樣品導入之量產, 將新設備/技術/材料開發應用.

· Mass production of NPI's key automotive and medical products from sample introduction, development and application of new equipment/technology/materials.

REQUIRED:

· 大學或碩士.

PREFERRED:

· NA

REQUIRED:

· PCB or FPC R&D engineer or Process engineer 7 years above

PREFERRED:

· Copper plating and Image transfer experience and work for Top 5 FPC or PCB company